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ap2142/ AP2152 document number: ds31571 rev. 6 - 2 1 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 0.5a dual channel current-limited power switch description the ap2142 and AP2152 are integrated high-side power switches optimized for universal serial bus (usb) and other hot-swap applications. the family of devices complies with usb 2.0 and available with both polarities of enable input. they offer current and thermal limiting and short circuit prot ection as well as controlled rise time and under-voltage lockout functionality. a 7ms deglitch capability on the open-drain flag output prevents false over-current reporting and does not require any external components. all devices are available in so-8 and msop-8ep packages. features ? dual usb port power switches ? over-current and thermal protection ? 0.8a accurate current limiting ? reverse current blocking ? 115m ? on-resistance ? input voltage range: 2.7v ? 5.5v ? 0.6ms typical rise time ? very low shutdown current: 1ua (max) ? fault report (flg) with blanking time (7ms typ) ? esd protection: 4.5kv hbm, 350v mm ? active high (AP2152) or active low (ap2142) enable ? ambient temperature range -40oc to 85c ? so-8 and msop-8ep (exposed p ad): available in ?green? molding compound (no br, sb) ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) ? ul recognized, file number e322375 ? iec60950-1 cb scheme certified pin assignments so-8 ( top view ) 1 2 3 4 8 7 6 5 nc out flg out gnd en in in msop-8ep 1 2 3 4 8 7 6 5 nc out flg out gnd en in in ( top view ) applications ? consumer electronics ? lcd tv & monitor, game machines ? communications ? set-top-box, gps, smartphone ? computing ? laptop, desktop, servers, printers, docking station, hub notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. see http://www.diodes.com for more in formation about diodes incorpor ated?s definitions of halogen- and antimony-free, "gree n" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds. typical applications circuit 0.1uf in gnd en2 out1 on 68uf power supply 2.7v to 5.5v 0.1uf off flg1 load 10k 10k flg2 en1 out2 68uf 0.1uf load 10uf AP2152 enable active high
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 2 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 available options part number channel enable pin (en) current limit (typ) recommended maximum continuous load current ap2142 2 active low 0.8a 0.5a AP2152 2 active high 0.8a 0.5a pin descriptions pin name pin number function so-8 msop-8ep gnd 1 1 ground in 2 2 voltage input pin en1 3 3 switch 1 enable input, active low (ap2142) or active high (AP2152) en2 4 4 switch 2 enable input, active low (ap2142) or active high (AP2152) flg2 5 5 switch 2 over-current and over-temperature faul t report; open-drain flag is active low when triggered out2 6 6 switch 2 voltage output pin out1 7 7 switch 1 voltage output pin flg1 8 8 switch 1 over-current and over-temperature faul t report; open-drain flag is active low when triggered exposed tab ? exposed tab exposed pad. it should be connected to gnd and thermal mass for enhanced thermal impedance. it should not be used as electrical ground conduction path. functional block diagram thermal sense driver flg2 out2 gnd in en2 uvlo current limit deglitch thermal sense driver uvlo current limit deglitch out1 flg1 en1 gnd current sense current sense ap2142, AP2152
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 3 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 absolute maximum ratings (@t a = +25c, unless otherwise specified.) symbol parameter rating unit esd hbm human body model esd protection 3 kv esd mm machine model esd protection 300 v v in input voltage 6.5 v v out output voltage v in + 0.3 v v en , v flg enable voltage 6.5 v i load maximum continuous load current internal limited a t j(max) maximum junction temperature 150 c t st storage temperature range (note 4) -65 to 150 c caution: stresses greater than the 'absolute maximum ratings' specified above, may cause perm anent damage to the device. these are stress ratings only; functional operation of the devic e at these or any other conditi ons exceeding those indicated in this specification is not impl ied. device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. semiconductor devices are esd sensitive and may be damaged by ex posure to esd events. suitable esd precautions should be taken when handling and transporting these devices note: 4. ul recognized rating from -30c to +70c (diodes qualified t st from -65c to +150c) recommended operating conditions (@t a = +25c, unless otherwise specified.) symbol parameter min max units v in input voltage 2.7 5.5 v i out output current 0 500 ma v il en input logic low voltage 0 0.8 v v ih en input logic high voltage 2 v in v t a operating ambient temperature -40 85 c
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 4 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 electrical characteristics (@t a = +25c, v in = +5v, unless otherwise specified.) symbol parameter test conditions min typ max unit v uvlo input uvlo r load = 1k ? 1.6 1.9 2.5 v i shdn input shutdown current disabled, i out = 0 0.5 1 a i q input quiescent current, dual enabled, i out = 0 100 160 a i leak input leakage current disabled, out grounded 1 a i rev reverse leakage current disabled, v in = 0v, v out = 5v, i rev at v in 1 a r ds(on) switch on-resistance v in = 5v, i out = 0.5a, -40c t a +85c msop-8ep 115 150 m ? so-8 120 160 m ? v in = 3.3v, i out = 0.5a, -40c t a 85c 140 180 m ? i short short-circuit current limit enabled into short circuit, c l = 68f 0.6 a i limit over-load current limit v in = 5v, v out = 4.8v, c l = 68f, -40c t a +85c 0.6 0.8 1.0 a i trig current limiting trigger threshold v in = v en , output current slew rate (<100a/ws), c l = 68f 1.0 a v il en input logic low voltage v in = 2.7v to 5.5v 0.8 v v ih en input logic high voltage v in = 2.7v to 5.5v 2 v i sink en input leakage v en = 5v 1 a t d(on) output turn-on delay time c l =1f, r load = 10 ? 0.05 ms t r output turn-on rise time c l =1f, r load = 10 ? 0.6 1.5 ms t d(off) output turn-off delay time c l =1f, r load = 10 ? 0.01 ms t f output turn-off fall time c l =1f, r load = 10 ? 0.05 0.1 ms r flg flg output fet on-resistance i flg =10ma 30 50 ? t blank flg blanking time c in =10f, c l = 68f 4 7 15 ms t shdn thermal shutdown threshold enabled, r load = 1k ? 140 c t hys thermal shutdown hysteresis 25 c ja thermal resistance junction-to-ambient so-8 (note 5) 110 o c/w msop-8ep (note 6) 60 o c/w notes: 5. test condition for so-8: device mounted on fr-4 2- layer board, 2oz copper, with minimum recommended pad layout. 6. test condition for msop-8ep: device mounted on fr-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer ground plane.
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 5 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 typical performance characteristics v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f figure 1. voltage waveforms: ap2142 (left), AP2152 (right) all enable plots are for ap2142 active low channel 1 turn-on delay and rise time 500s/div channel 1 turn-off delay and fall time 500s/div channel 2 turn-on delay and rise time 500s/div channel 2 turn-off delay and fall time 500s/div vout 1 2v/div ven 1 5v/div c l = 1f t a = +25c r l = 10 ? vout 1 2v/div ven 1 5v/div c l = 1f t a = +25c r l = 10 ? vout 2 2v/div ven 2 5v/div c l =1f t a = +25c r l = 10 ? vout 2 2v/div ven 2 5v/div c l = 1f t a = +25c r l = 10 ?
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 6 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 typical performance characteristics (cont.) channel 1 turn-on delay and rise time 500s/div channel 1 turn-off delay and fall time 500s/div channel 2 turn-on delay and rise time 500s/div channel 2 turn-off delay and fall time 500s/div channel 1 short circuit current, device enabled into short 500s/div channel 2 short circuit current, device enabled into short 500s/div iout 1 200ma/div ven 1 5v/div v in = 5v t a = +25c c l = 22f iout 2 200ma/div ven 2 5v/div v in = 5v t a = +25c c l = 22f vout 1 2v/div ven 1 5v/div c l = 100f t a = +25c r l = 10 ? vout 1 2v/div ven 1 5v/div c l = 100f t a = +25c r l = 10 ? vout 2 2v/div ven 2 5v/div c l = 100f t a = +25c r l = 10 ? vout 2 2v/div ven 2 5v/div c l = 100f t a = +25c r l = 10 ?
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 7 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 typical performance characteristics (cont.) channel 1 inrush current 1ms/div channel 2 inrush current 1ms/div channel 1 1 ? load connected to enabled device 2ms/div channel 1 2 ? load connected to enabled device 2ms/div channel 2 1 ? load connected to enabled device 2ms/div channel 2 2 ? load connected to enabled device 2ms/div iout 1 1a/div vflag 1 2v/div v in = 5v t a = +25c c l = 22f iout 1 1a/div vflag 1 2v/div v in = 5v t a = +25c c l = 22f iout 2 1a/div vflag 2 2v/div v in = 5v t a = +25c c l = 22f iout 2 1a/div vflag 2 2v/div v in = 5v t a = +25c c l = 22f iout 1 200ma/div ven 1 5v/div v in = 5v t a = +25c r l = 10 ? c l = 470f c l = 220f c l = 100f iout 2 200ma/div ven 2 5v/div v in = 5v t a = +25c r l = 10 ? c l = 470f c l = 220f c l = 100f
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 8 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 typical performance characteristics (cont.) channel 1 short circuit with blanking time and recovery 20ms/div channel 2 short circuit with blanking time and recovery 20ms/div channel 1 power on 1ms/div channel 2 power on 1ms/div channel 1 uvlo increasing 1ms/div channel 1 uvlo decreasing 10ms/div iout 200ma/div vin 2v/div vin 2v/div iout 200ma/div t a = +25c c l = 22f r l = 10 ? t a = +25c c l = 22f r l = 1 0 ? ? iout 200ma/div ven 5v/div vin 5v/div vflag 5v/div iout 200ma/div ven 5v/div t a = +25c c l = 22f r l = 10 ? iout 1a/div vout 5v/div v in = 5v t a = +25c c l = 22f vflag 5v/div vflag 5v/div iout 1a/div vout 5v/div v in = 5v t a = +25c c l = 22f
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 9 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 typical performance characteristics (cont.) channel 2 uvlo increasing 1ms/div channel 2 uvlo decreasing 10ms/div channel 1 enabled and shorted with channel 2 disabled 100ms/div channel 1 disabled and channel 2 enabled 50ms/div iout 200ma/div vin 2v/div vin 2v/div iout 200ma/div t a = +25c c l = 22f r l = 10 ? t a = +25c c l = 22f r l = 10 ? vout 2 5v/div iout 2 500ma/div t a = +25c c l = 22f vout 1 5v/div vflag 1 5v/div vout 1 5v/div vout 2 5v/div t a = +25c c l = 22f ven1 5v/div ven2 5v/div
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 10 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 typical performance characteristics (cont.) turn-on time vs input voltage 0 100 200 300 400 500 600 700 800 1.522.533.544.555.56 input voltage (v) turn-on time (us) turn-off time vs input voltage 28 28 29 29 30 30 31 31 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 input voltage (v) turn-off time (us) rise time vs input voltage 0 100 200 300 400 500 600 1.522.533.544.555.56 input voltage (v) rise time (us) fall time vs input voltage 19 20 21 22 23 24 25 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 input voltage (v) fall time (us) supply current, output enabled vs ambient temperature 30 35 40 45 50 55 60 65 -60 -40 -20 0 20 40 60 80 100 ambient temperature (c) supply current, output enabled (ua) supply current, output disabled vs ambient temperature 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 -45 -25 -5 15 35 55 75 95 ambient temperature (c) supply current, output disabled (ua) vin=2.7v vin=5.0v vin=3.3v vin=5.5v vin=5.0v vin=5.5v vin=3.3v vin=2.7v c l = 1f r l = 10 ? t a = +25c c l = 1f r l = 10 ? t a =+ 25 c c l = 1f r l = 10 ? t a =+25c c l = 1f r l = 10 ? t a =+ 25 c
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 11 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 typical performance characteristics (cont.) static drain-source on-state resistance vs ambient temperature 100 110 120 130 140 150 160 170 180 190 200 -60 -40 -20 0 20 40 60 80 100 ambient temperature (c) static drain-source on-state resistance (m ? ) short-circuit output current vs ambient temperature 630 640 650 660 670 680 690 700 710 -60 -40 -20 0 20 40 60 80 100 ambient temperature (c) short-circuit output current (ma) undervoltage lockout vs ambient temperature 1.95 1.96 1.97 1.98 1.99 2.00 2.01 2.02 2.03 2.04 2.05 -60 -40 -20 0 20 40 60 80 100 ambient temperature (c) undervoltage lockout (v) threshold trip current vs input voltage 1.10 1.11 1.12 1.13 1.14 1.15 2.8 3.3 3.8 4.3 4.8 5.3 input voltage (v) threshold trip current (a) current limit response vs peak current 0 5 10 15 20 25 30 35 40 45 2345678910 peak current (a) current limit response (us) vin=2.7v vin=3.3v vin=5v vin=2.7v vin=3.3v vin=5.0v vin=5.5v uvlo falling uvlo rising v in = 5v t a = +25c c l = 22 f t a = +25c c l = 22f
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 12 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 application information power supply considerations a 0.01- f to 0.1- f x7r or x5r ceramic bypass capacitor between in and gnd, close to the device, is recommended. placing a high-value electrolytic capacitor on the input and out put pin(s) is recommended when the output l oad is heavy. this precaution reduces pow er-supply transients that may cause ringing on the input. additionally, bypassing the output with a 0.01- f to 0.1- f ceramic capacitor improves the immunity of the device to shor t-circuit transients. over-current and short circuit protection an internal sensing fet is employed to c heck for over-current conditions. unlike curr ent-sense resistors, sense fets do not inc rease the series resistance of the current path. when an over current condition is detected, the device maintains a constant output current and r educes the output voltage accordingly. complete shutdown occurs only if the fault stays long enough to activate thermal limiting. three possible overload conditions can occur. in the first condition, the output has been shorted to gnd before the device is e nabled or before v in has been applied. the ap2142/AP2152 senses the s hort circuit and immediately clamps output current to a certain safe level name ly i limit . in the second condition, an output short or an overload occurs while the device is enabled. at the instance the overload occur s, higher current may flow for a very short period of time before the current limit function can react. after the cu rrent limit function has tripped (reached the over-current trip threshold), the device switches into curr ent limiting mode and the current is clamped at i limit . in the third condition, the load has been gradually increased beyond the recommended operating current. the current is permitte d to rise until the current-limit threshold (i trig ) is reached or until the thermal limit of the device is exceeded. the ap2142/AP2152 is capable of delivering current up to the current-limit threshold without damaging the device. once the threshold has been reached, the device switches into its c urrent limiting mode and is set at i limit . flg response when an over-current or over-temperature s hutdown condition is encountered, the flg open -drain output goes active low after a n ominal 7-ms deglitch timeout. the flg output remains low until both over-cur rent and over-temperature condi tions are removed. connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the flg due to the 7-ms d eglitch timeout. the ap2142/AP2152 is designed to eliminate fals e over-current reporting without the need of external components to remove unwan ted pulses. power dissipation and junction temperature the low on-resistance of the internal mosfet allows the small surface-mount packages to pass large current. using the maximum o perating ambient temperature (t a ) and r ds(on) , the power dissipation can be calculated by: p d = r ds(on) i 2 finally, calculate the junction temperature: t j = p d x r ja + t a where: t a = ambient temperature c r ja = thermal resistance p d = total power dissipation thermal protection thermal protection prevents the ic from damage when heavy-overl oad or short-circuit faults are present for extended periods of time. the ap2142/AP2152 implements a thermal sensing to monitor the operati ng junction temperature of the power distribution switch. once the die temperature rises to approximately 140c due to excessive power di ssipation in an over-current or short-circuit condition the i nternal thermal sense circuitry turns the power switch off, thus preventing the power sw itch from damage. hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25c before the switch turns back on. the switch continues to cycle in this manner until the load fault or input power is removed. the flg open-drain output is asserted when an ove r-temperature shutdown or over-current occurs with 7-ms degl itch.
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 13 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 application information (cont.) under-voltage lockout (uvlo) under-voltage lockout function (uvl o) keeps the internal power switch from bei ng turned on until the power supply has reached a t least 1.9v, even if the switch is enabled. whenever the input voltage falls below approximately 1.9v, the power switch is quickly turned off. th is facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. host/self-powered hubs hosts and self-powered hubs (sph) have a local power supply that powers the embedded functions and the downstream ports (see fi gure 2). this power supply must provide from 5.25v to 4.75v to the board side of the downstream connection under both full-load and no-load c onditions. hosts and sphs are required to have current-limit protection and must repor t over-current conditions to the usb controller. typical s phs are desktop pcs, monitors, printers, and stand-alone hubs. figure 2. typical two-port usb host / self-powered hub generic hot-plug applications in many applications it may be necessary to remove modules or pc boards while the main unit is still operating. these are consi dered hot-plug applications. such implementations require th e control of current surges seen by the main power supply and the card being inser ted. the most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. due to the controlled rise times and fall times of the ap2142/AP2152, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system . the uvlo feature of the ap2142/AP2152 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. by placing the ap2142/AP2152 between the v cc input and the rest of the circuitry, the input po wer reaches these devices first after insertion. the typical rise time of the switch is approximately 1ms, providi ng a slow voltage ramp at the output of the device. this implement ation controls system surge current and provides a hot-p lugging mechanism for any device.
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 14 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 ordering information part number package code packaging 13? tape and reel quantity part number suffix ap21x2sg-13 s so-8 2500/tape & reel -13 ap21x2mpg-13 mp msop-8ep 2500/tape & reel -13 marking information (1) so-8 ap21x x ( top view ) yy ww x x part number logo ww : week : 01~52; 52 yy : year : 08, 09,10~ g : green x : internal code 8765 1 2 34 4 : active low 5 : active high 2 : 2 channel represents 52 and 53 week (2) msop-8ep ap21x x ( top view ) y w x e part number logo y : year : 0~9 a~z : green 87 65 1 234 4 : active low 5 : active high 2 : 2 channel a~z : 27~52 week; z represents w : week : a~z : 1~26 week; 52 and 53 week msop-8ep
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 15 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 package outline dimensions (all dimensions in mm.) please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. (1) package type: so-8 (2) package type: msop-8ep so-8 dim min max a - 1.75 a1 0.10 0.20 a2 1.30 1.50 a3 0.15 0.25 b 0.3 0.5 d 4.85 4.95 e 5.90 6.10 e1 3.85 3.95 e 1.27 typ h - 0.35 l 0.62 0.82 0 8 all dimensions in mm msop-8ep dim min max typ a - 1.10 - a1 0.05 0.15 0.10 a2 0.75 0.95 0.86 a3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 d 2.90 3.10 3.00 d1 1.60 2.00 1.80 e 4.70 5.10 4.90 e1 2.90 3.10 3.00 e2 1.30 1.70 1.50 e3 2.85 3.05 2.95 e - - 0.65 l 0.40 0.80 0.60 a 0 8 4 x - - 0.750 y - - 0.750 all dimensions in mm gauge plane seating plane detail ?a? detail ?a? e e1 h l d e b a2 a1 a 45 7 ~ 9 a3 0.254 1 d a a1 a2 e e y x seating plane gauge plane l d 8xb see detail c detail c c a e1 e3 a3 e2 4 x 1 0 4 x 1 0 0.25 d1
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 16 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. (1) package type: so-8 (2) package type: msop-8ep dimensions value (in mm) x 0.60 y 1.55 c1 5.4 c2 1.27 dimensions value (in mm) c 0.650 g 0.450 x 0.450 x1 2.000 y 1.350 y1 1.700 y2 5.300 x c1 c2 y g x c y y2 y1 x1
ap2142/ AP2152 document number: ds31571 rev. 6 - 2 17 of 17 www.diodes.com january 2013 ? diodes incorporated ap2142/ AP2152 important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or an y product described herein; neither does di odes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or us er of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2013, diodes incorporated www.diodes.com

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